Thermopositive paste PP122

APPOINTMENT

The development is designed to remove heat from the electronic devices fuel elements such as processors, chipsets, video accelerators, computers etc.

MAIN CHARACTERISTICS OF THE DEVELOPMENT

The use in the manufacture of thermal paste of ZnO nanoparticles instead of ZnO classified flour leads to the higher values of its thermal conductivity coefficient from 0, 8 to 2, 5 W/ (м∙K)

MAIN ADVANTAGES OF THE DEVELOPMENT

The improvement of heat removal from the fuel elements of electronic devices is achieved due to the implemented three times higher coefficient of thermal conductivity compared to the existing analogue - Silicon Organic Paste of Thermal Conductive - 8

STATE OF INTELLECTUAL PROPERTY PROTECTION

Received a patent of Ukraine for the utility model

MARKET DEMAND

The development will be in demand in electrical engineering. It can be implemented both in Ukraine and abroad

STATUS OF READINESS OF THE DEVELOPMENT

The manufacturing technology is developed