Substrates for chips with a diameter from 25 to 250 mm and up to 40 mm thick.
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Ukraine, Kharkov
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Technical characteristics
- Country of manufactureUkraine
Description
Preparations for substratesPreparations for substrates for micro and optoelectronics with a diameter from 25 to 250 mm and up to 40 mm thick. |
| Sizes, mm | Diameter 25... 250, thickness is up to 40 |
| Accuracy of production, mm on overall dimensions on thickness |
± 0,05 ± 0,05 |
| Blocks, doubles, the twinning layers and cracks, inclusions seen in the polarized light |
Are not allowed |
| Quality of a surface | Polished surface |
| Roughness of a surface (Ra), micron | <1 |
| Transmission coefficient (): Visible and IK-area of a range (to 4,5 microns) UF-area of a range (0,2 microns) |
85-87 70 |
| Internal tension, kg/mm2 | ≤ 2 |
| Crystallographic orientation |
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Substrates for chips with a diameter from 25 to 250 mm and up to 40 mm thick.