Laboratory system of the analysis of thickness of films ST4000-DLX

The system of measurement of thickness of films was developed for scientific researches and developments in laboratories for measurement of thickness of thin films, and also in monitoring systems of quality and monitoring of process in lines of production; semiconductors, FPD, in nanotechnologies, electronic materials and special films. So, for example, in the semiconductor industry, each thin film besieged on a substrate has to be received on the basis of exact design and the drawing. The system of the analysis of thickness of thin films is used for control of process of production and definition of a level of quality of a product by measurement of thickness of thin films. There are various methods for measurement of thickness of a film: the stylus on the basis of mechanical technology, microscopic technologies and optical technologies, as a rule, most widely used. The measuring system thickness of a film of SpectraThick of the K-MAC company, is the adapted advanced technology with use of an optical method. Thus, the interference phenomenon between the reflected light signals on a surface of a film and a surface of a substrate or a difference of phases of light defines properties of a film. Thus, we can measure not only thickness of a film, but also its optical parameters constant. If the film transparent also supports an optical interference, then any sample of such film can be measured with Spectra Thick the profilometer the interferometer of the K-MAC company. Thickness of each layer of a multilayered film can be measured by means of mathematical calculation for formulas. Thanks to intuitively clear interface, operation with use of the software very just will allow to calculate film thickness. The analysis will be nondestructive, i.e. without prejudice to a sample, having the wide range of thickness from agstry to tens of microns. To download the brochure.

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