설명
Die Bonder SDB-30US
Features
Specification
Features
최초 Universal 장비로 LOC, MCP, BOC 작업 가능 |
One Touch Conversion 기능 적용 |
- Pre-Baker Rail 및 폭 자동 Conversion 기술 적용 |
- 최대 Bonding Force: 8kg 대응 가능- |
- 사용자 중심의 GUI 구성 |
- Global CE 인증 적용 |
Specification
System Capability |
Cycle Time : 700ms |
X,Y Accuracy : ± 35㎛ |
Θ Rotation : ±0.5° |
Bond Head |
Bond Force : 250 ~ 8000g |
Force Control : Load Cell |
Pattern Recognition System |
PR System : 256 Grey Levels |
Resolution : 640 Pixels x 480 Pixels |
Position Accuracy : ±1/4 Pixel |
Epoxy Dispensing System |
XY Stroke : X Axis ±25mm , Y Axis ±45mm |
XY Resolution : X,Y ± 2㎛ |
Contact the seller
Die Bonder SDB-30US
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